Quantcast Desktop Wire Bond Machine: Flea2 Application Story
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Desktop Wire Bond Machine: Flea2 Application Story

F&K Delvotev 5632

F&K Delvotec 56xx series of desktop wire bond machines

Wire bonding is a semiconductor device fabrication method that uses very fine gold, copper or aluminum wire—often less than 100 micrometers in diameter—to make electrical interconnects between a microchip and other electronics. While many automatic wire bond machines are designed for high volumes with minimal product variants, there is also demand for smaller "desktop" bonders that can be used for laboratory, small-scale production and testing applications.

F&K Delvotec logoThe 56xx Desktop Micro Factory® from F&K Delvotec Austria is designed for low production volumes and is capable of producing high quality products, while still having the flexibility of a lab bonder in converting between different jobs. The 56xx wire bonder is also the very first that can be equipped with four (4) different bond heads for all existing wire bond technologies (wedge and ball bonding, pull and shear testing), which can be individually mounted and dismounted with a quick-change chuck within seconds.

56xx series bond head change  

Operator (left) changing bond head used for targeting (right)

As with other manufacturing processes, visual control of the wire bonding process is critical. The 56xx wire bonder uses three color Flea2 IEEE-1394b digital CCD cameras for visual control of the wire bond placement and adjustment and correction of the bonding wire position. A Flea2 is contained within each bond head and connected to an IEEE-1394 cable with locking screw connectors. Each bond head can be easily changed so the camera magnification can be matched to the required resolution, and the offset between optical axis and bond tool does not have to be determined after changing the bond head.

Historically, controlling wire bond interconnects and performing subsequent bond position corrections has been a manual process performed by the operator, and assisted by images provided by the Flea2 camera. However, with the introduction of F&K Delvotec's optional Pattern Recognition Unit (PRU), correction of bond positions can be done automatically. The Flea2 fully complies with the IIDC 1394-based Digital Camera (DCAM) specification, making it compatible with many of the third-party software packages that are commonly used for building applications like the PRU, such as Cognex® VisionPro®, National Instruments LabVIEW, and MVTec™ HALCON.

56xx bonder control

"We identified early on in the design of the 56xx series that we required a very small, yet powerful, IEEE-1394 CCD camera," explains Siegfried Seidl, Managing Director of F&K Delvotec Austria. "We knew of Point Grey through various tradeshows and in talking with our team in Ottobrunn [near Munich]. When we contacted Point Grey with our requirements, they were quick to send us a sample of the Flea. The competitive pricing of the camera, and its compatibility with other vision software packages, were additional factors that made our decision easier."

Point Grey cameras, such as the Flea2 and remote head Dragonfly2, are ideal for space-constrained industrial applications where size and image quality are of the utmost importance. Aggressive pricing, industry standard mechanics, full IIDC DCAM v1.31 compliance, and industry leading technical support further make Point Grey cameras an ideal choice for OEMs and system integrators.